TAU – EE fablab process

 

General Description

AZ 5214E

lithography

Author: Moti Ben-David

Date: 06/12/2005

Comments:

 

 

 

 

 

 

Process

 

 

Singe

 

 

 

120 deg   5min

Spin

 

 

250 rpm/sec to 2000 rpm 40 sec

Pre bake

 

 

110 deg   2 min

Exposure

 

 

1.2 sec    (MA–6)

Reversal bake

 

 

120 deg   2min

Flood exposure

 

 

60sec      (MA-6)

Develop

 

 

AZ726MIF    25 sec

Rinse

 

 

DI Water

Post bake

 

 

120 deg   2min

 

General Description

 

 

Thickness

2.5 mm