TAU – EE fablab process

 

General Description

SOG 500 F 1 Layer

Objective: passivation

Author: Itsik Kalifa

Date: 11/1/2005

Comments:

 

 

 

 

 

 

Process

 

 

Singe

 

Comments:

 

140 deg, 5 min

Spin

 

 

300 rpm/sec to 2200 rpm 40 sec

Bake

 

 

from

Cool down

 

 

from

Cure

With N2 flow

 

from R.T to   

 1 hour

from  to R.T

 

General Description

 

 

Thickness

0.85 mm