TAU – EE fablab process
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General Description |
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TI35ES |
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Objective: RIE mask , lithography |
Author: Itsik Kalifa |
Date: |
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Comments: |
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Process |
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Singe |
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120 deg, 10 min |
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Spin |
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100 rpm/sec to 500 rpm 5 sec 300 rpm/sec to 3000 rpm 40 sec |
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Pre bake |
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100 deg 2 min |
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Exposure |
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Delay |
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Reversal bake |
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Flood exposure |
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Develop |
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Rinse |
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DI Water |
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Hard bake |
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,726MIF 
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General Description |
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Thickness |
3.5 mm |
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