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Journal of Microwave Power
and Electromagnetic Energy (JMPEE) |
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Industrial Processing Via
Variable Frequency Microwaves Part I: Bonding Applications [PDF] |
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J.B. Wei, K. Ngo, D.A. Tucker, Z. Fathi, F.L. Paulauskas and W.G. Johanson 1998 33 1 10-17 |
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Abstract Variable frequency microwaves
(VFM), offer a unique advantage in processing advanced materials, i.e.
providing rapid, uniform and selective heating over a large volume at a high
energy coupling efficiency. This has been demonstrated on industrial scales
in various applications, including bonding of polymers or composite panels,
curing of polymer or composite parts, drying of polymer films and preheating
of polymer composites. This paper presents two bonding applications: I)
bonding of polymer composites, including urethane-based SRIM (structure
reaction injection moulding) glass fiber composite panels and fiberglass
reinforced polyester panels, for automotive applications, and 2) bonding
(curing) of flip-chips (FC) for electronic packaging applications. Because
VFM has the ability to provide a selective yet uniform heating of adhesives,
this technology provides an attractive alternative to realize high-speed
bonding for many industrial applications. Key Words: Variable frequency
microwave, Bonding, Composite, Adhesives, Uniform heating |
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