Consortium <0.25 m m/300 mm

General

     Today's rapidly changing technologies pose several challenges, which are felt by the commercial sector and academic institutes. The cost of next generation technologies and tools decreases. Short time-to-market is critical. Today, the need for technological integration and cooperation between researchers, developers and suppliers is absolutely essential.
     The Quarter Micron Consortium provides a unique solution for facing these challenges by promoting close R&D ties between Israeli companies and academic institutes. These partnerships along with cost sharing and government assistance result in enhanced technologies and lower costs relieving the company's cost burden. Novel advanced products are developed and delivered to broader markets hopefully yielding technological and financial success.
     The Consortium strives to: (1) Develop and implement cost-effective generic technologies (2) Reduce R&D costs and time-to-market (3) Increase worldwide marketing ability (4) Construct Infrastructure, labs and facilities that strengthen Israeli industry's technological and competitive edge (5)Promote wide-ranging collaboration between Israeli companies and academic research institutes (6) Present Israeli companies as leading international force for developing integrated breakthrough technologies and marketing advanced products.

 

 

Consortium members:

     STEAG-CVD develops, manufactures and markets highly sophisticated integrated, single wafer rapid thermal, chemical vapor deposition (RT-CVD) ssytems. STEAG-CVD's Integra systems feature a robotic arm wafer handler and up to four compatible process modules for processing various applications including Polysilicon, Dielectric Layers, HSG and Vapor phase cleaning. The systems' target applications are formation of gate stack and stacked capacitors.

ADDRESS:

 

 

Ramat Gavriel Industrial Park, P.O.B. 171, Migdal-Ha'emek 10551 Israel
Tel: 972-6-6448444 ; Fax: 972-6-6440551 ; E-mail: agi@agi.co.il

 

 

     Jordan Valley Applied Radiation is a technologica leader in X-ray Spectroscopy for the last three decades. The Company has set new standards in developing technologies of Energy Dispersive X-ray Fourescence (ED-XDF) Spectroscopy equipment for elemental analysis in thin films, solids and liquids. It specializes in three main areas: Elemental analyzers for the Semiconductor Industry, Process Control market and General analysis market.

ADDRESS:

 

 

Ramat Gavriel Industrial Park, P.O.B. 103, Migdal-Ha'emek 23100 Israel
Tel: 972-6-6543666 ; Fax: 972-6-6547472 ; E-mail: itzik@jordanvalley.com

 

     RICOR is an industry-leader in developing cryogenic and vascuum technologies. Cutting-edge technological developments enable RICOR to be a major supplier for a broad range of Cryogenic Closed Cycle Coolers for various applications including thermal imaging, superconductivity, scientific instrumentation and vacuum pumping applications.

ADDRESS:

 

 

En Harod Ihud 18960 Israel
Tel: 972-6-6531703 ; Fax: 972-6-6532424 ; E-mail: pundak@inter.net.il

 

 

     Known worldwide as a state-of-the-art manufacturer of semiconductor integrated circuits (ICs) on silicon wafers, Tower annually produces more than 200 different products for a variety of applications including personal computers and peripherals, multimedia products, data and voice communication and automotive.
     Due to extensive investment in R&D and modernization of its manufacturing facilities, the company produces a range of CMOS technology feature sizes from 1.0 microns to 0.5 microns in multiple levels of metal and Poly.

ADDRESS:

 

 

Ramat Gavriel Industrial Park, P.O.B. 619, Migdal-Ha'emek 23105 Israel
Tel: 972-6-6506611 ; Fax: 972-6-6547788 ; E-mail: marketing@tsl.co.il

 

 

     3T-True Temperature Technologies develops and markets an innovative technology for highly accurate non-contact temperature measurements, which solve problems of unknown emissivity variations. 3T's novel and highly accurate temperature measurement products are the sole solution for dealing with the unstable target and intermediate conditions often found in the metals' industry.
     In RTP/RT-CVD processes, emissivity changes are large and sudden.

ADDRESS:

 

 

 

Theradion Industrial Park, Misgav 20179 Israel
Tel: 972-4-999025 ; Fax: 972-4-999031 ; E-mail: 3t@netvision.net.il

 

 
     Tel-Aviv University, hosts the <0.25 mm/ 300 mm consortium central lab. The lab includes about 1200 square feet of class 100 clean rooms and operates under strict safety and clean room operational regulations. The laboratory includes all the infrastructure for the preparation, cleaning and storage of silicon wafers with diameters of up to 200 mm. In addition the lab is equiped with a rapid thermal processing chemical vapor deposition (RTPCVD) cluster tool that is produced by STEAG Inc. In addition there is an XRF system by Jordan Valley Applied Radiation, an emissivity free pyrometer made by 3T and some metrology tools. The lab is equiped with a Plasmatherm 770 - inductive coupled plasma etcher, and a Nextal 960 reactive ion etcher.
     The lab is designed to study basic silicon processing, process integration, metrology and inspection. It will also allow the repoduction of simple devices such diodes, MOS capacitors, metal-semiconductor contacts, interconnects and simple thin-film structures. It will also allow the completion of critical levels of silicon CMOS structures that will be produced by external foundries.

ADDRESS:

Ramat-Aviv, Tel-Aviv 69978, Israel
Tel: 972-3-6407926 ; Fax: 972-3-6423508 ; E-mail: microlab@eng.tau.ac.il

 
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