Design Support Systems for Electromechanical/MEMS Design
This project is planned to serve as a testbed for several technologies:
- Collaborative Design
- Cased-Based Reasoning
- Design Rationale
- Reich, Y. and Kaptsan, I. (1996), Capturing electronic packaging design rationale by
an artifact-centered linguistic approach, Presented at The 26th Israel
Conference on Mechanical Engineering, (Haifa, IL), Technion.
(Postscript file, 64K; Zipped PDF file, 530K)
- Quality Function Deployment
If you have any comments or questions, please send
me a message.
Last modified by Yoram Reich on Monday, June. 17, 1996